首页> 外文会议>Device Research Conference >Reduced 1/f noise and g/sub m/ degradation for sub-0.25 /spl mu/m MOSFETs with 25 /spl Aring/-50 /spl Aring/ gate oxides grown on nitrogen implanted Si substrates
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Reduced 1/f noise and g/sub m/ degradation for sub-0.25 /spl mu/m MOSFETs with 25 /spl Aring/-50 /spl Aring/ gate oxides grown on nitrogen implanted Si substrates

机译:具有25 / SPR的SUP-0.25 / SPL MU / M MOSFET的1 / F噪声和G / SUB M /劣化,用25 / SPL浇灌/ -50 / SPL浇筑/浇口氧化物在氮气植入的Si衬底上生长

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We introduce a light dose of nitrogen implant (N/sup +/ I/I) into the Si substrate before growing the oxides, and incorporated /spl sim/3-4 atomic% of nitrogen in the oxides. Consequently, the 1/f noise is reduced by a factor of 2-5, and the g/sub m/ degradation is reduced by a factor of 5. The N/sup +/ I/I does not affect the oxide breakdown field which continues to follow the hole-trap model as the oxide thickness reaches 25 /spl Aring/ in this experiment. MOSFETs of 0.2 /spl mu/m physically are then fabricated with 25 /spl Aring/ oxides on N/sup +/ I/I substrates.
机译:在生长氧化物之前,我们将一剂氮气植入物(N / SUP + / I / I / I / I / I / I / I)引入Si底物中,并在氧化物中掺入/ SPL SIM / 3-4原子%氮。因此,1 / f噪声减小了2-5的因子,并且G / sub m /劣化减少了5系数5.n / sup + / i / i不影响氧化物分解字段随着氧化物厚度达到25 / SPL在本实验中,继续跟随孔阱模型。然后在N / SUP + / I / I / I衬底上用25 / SPL浇铸/氧化物制造0.2 / SPL mu / m的MOSFET。

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