During the rapid contact solidification process, a thermal contact resistance usually exists at the interface between the molten metal and the substrate. Determination of the interfacial thermal contact resistance is very important As a simulation of rapid contact solidification process, a sudden falling experiment is conducted in this study. A special thin film sensor is developed utilizing micro-fabrication technique. The special sensor, which has a junction thickness of only 1 μm, is employed to record the extremely rapid temperature changes at the substrate surface without disturbing the solidification process. Once the thermal histories at the substrate surface have been known, a much more simple procedure is proposed for determining the thermal contact resistance. The thermal contact resistance, as a function of time, during the rapid contact process of molten metal (Indalloy-l 58) with copper substrate is obtained. The validity of the present method is demonstrated.
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