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A symmetric GaAs MESFET structure with a lightly doped deep drain for linear amplifiers operating with a single low-voltage supply

机译:一个对称的GaAs Mesfet结构,具有轻微掺杂的深漏极,用于用单个低压供应操作的线性放大器

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An improved symmetric GaAs MESFET structure with a lightly doped deep source/drain is proposed for application to power amplifiers in mobile communication terminals. With lightly doped deep drain, the impact ionization falls as the electron current expands and the current density decreases. Thus, the breakdown voltage rises, while a high transconductance and low parasitic resistance are maintained. Furthermore, the symmetric structure suits for mass production because of its fabrication process without mask alignment precision. This structure was fabricated using the WNx/W self-aligned gate process, and DC and RF characteristics were evaluated. The power-added efficiency was 37% at an adjacent channel leakage power of -55 dBc for 37%-shift QPSK modulated input signals at 1.9 GHz with a single positive supply voltage of 3 V. The efficiency was also high at a lower supply voltage: 34% at 1.2 V.
机译:提出了一种具有轻掺杂深源/漏极的改进的对称GaAs Mesfet结构,用于应用于移动通信终端中的功率放大器。由于电子电流膨胀并且电流密度降低,撞击电离落下。因此,击穿电压升高,而保持高跨导和低寄生电阻。此外,由于其制造工艺而没有掩模对准精度,因此对称结构适用于批量生产。使用WNX / W自对准栅极工艺制造该结构,评价DC和RF特性。电力增加的效率在-55dBc的相邻通道泄漏功率下为37%-shift QPSK调制输入信号,在1.9 GHz,单个正电源电压为3 V。电源电压较低的效率也高。 :34%在1.2 V.

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