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Twelfth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. Proceedings

机译:第十二届年度IEEE半导体热测量和管理研讨会。议程

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摘要

The following topics were dealt with: component level characterization; experimental methods and application; computational and analytical modeling; thermal design for manufacturing and reliability; heat sink modeling and characterization; PCB role in component and system level cooling.
机译:处理以下主题:组件级别表征;实验方法和应用;计算和分析建模;制造和可靠性的热设计;散热器建模与表征; PCB在元件和系统级冷却中的作用。

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