Thermal modeling of densely packed electronic systems

摘要

Thermal modeling of densely packed electromechanical systems is investigated by conducting three dimensional, steady-state computations of flow and heat transfer. Coupled conduction and natural convection in a densely packed system is considered. For a fixed energy generation rate, computations are performed for different thermophysical properties of the system walls, and component configurations in sealed and vented systems. Overall lower temperatures are observed in vented systems with high thermal conductivity system walls and large component configurations. An empirical correlation is developed for the maximum component temperature over the range of parameters studied.