FRACTURE ELECTRONICS - FRACTURE ANALYSIS OF MICRO-ELECTRONIC COMPONENTS AND CHIPS

摘要

Various methods of microdeformation analysis (e.g. micro moire and microDAC, laser field measurement technique, acousto-microscopy, X-ray stress analysis) are coupled with FEM simulation to characterize the local thermo-mechanical behaviour of microsystems e.g. chipcards, printed circuit boards and micro-sensor components. Creep crack and thermal fatigue crack behaviour in microcomponents have been studied in detail.