Surface mount technology and power applications

摘要

The author describes a half-day short course which introduces attendees to the basics of surface mount technology (SMT), comparing SMT to standard through-hole circuit board design and manufacturing techniques. Examples of equipment specific to SMT board assembly are available for attendees to examine and use. The use of concurrent engineering in sucessful SMT design and manufacturing is discussed. In addition, the course discusses some of the issues necessary to deal with power applications and thermal issues associated with SMT board design. Examples of software useful in thermal analysis of circuit boards are given. An overview of the short course schedule is also given.