Two-dimensional infrared focal plane array detectors in general are characterized by a significantly larger size and thermal mass than the traditional discrete element detectors. Usually, they contain an `on-board' signal processor. The size and thermal mass impact is significant in the radiation shield/cold optics subassembly. In order to achieve miniaturization, low input power and fast cool down time, a combined team of Cincinnati Electronics Corporation, Mason, Ohio and RICOR-Cryogenic and Vacuum Systems, EnHarod (IHUD), Israel are working on the development of a Miniature Integral Cooler/Dewar Assembly-IDCA specially tailored for 2-D FPA type detectors. A progress report, based on accumulated experimental data gathered through the operation of engineering models of this type in a laboratory level and in a system level under various conditions, is presented.
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