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The IEEE Gel Task Force: an early look at the final testing

机译:IEEE凝胶工作组:早期看最终测试

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The IEEE special task force exploring the corrosion-inhibiting performance of silicon gels is now in its third year. Previous progress reports are reviewed. All the previous data has proved that satisfactory semiconductor chip protection from corrosion is possible using silicone gels and have indicated that nitride protection alone is not enough. These data were based on small, preliminary samples. However, small samples are not adequate for null hypothesis testing, i.e. whether gels prevent corrosion failures well enough to justify their use in military packaging. Ongoing testing based on larger sample sizes is discussed. Compared to the early testing of two or three samples of each type of gel covering, the sample size is now 60 samples of each of 9 gel-assembly combinations. Testing is being done at 10 test locations, with redundant testing for each cell. The sample sizes and the redundant measurements permit the first presentation of statistically significant data for testing the performance possibilities.
机译:探索硅胶腐蚀性能的IEEE特殊工作队现在是第三年。审核了以前的进度报告。所有以前的数据都证明,使用硅胶凝胶可以采用腐蚀的令人满意的半导体芯片保护,并表明单独的氮化物保护是不够的。这些数据基于小型初步样本。然而,小型样品不能足以用于无效假设检测,即凝胶是防止腐蚀的腐蚀性足以证明其在军用包装中的用途。讨论了基于较大样本尺寸的持续测试。与每种凝胶两三个样品的早期测试相比,样品大小现在为9个凝胶组合组合的60个样品。在10个测试位置进行测试,对每个单元进行冗余测试。样本尺寸和冗余测量允许首先呈现用于测试性能可能性的统计上有效数据。

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