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Electron curing of coatings and adhesives for wire and cable application

机译:用于电线和电缆应用的涂层和粘合剂的电子固化

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The curing of the high solvent content coatings used in thermal drying towers in the manufacture of enamelled wire constitutes a process of high specific energy consumption and significant atmospheric pollution. Experimental results are presented demonstrating the use of low energy electrons (150 keV) from a curtain type electron source for the uniform curing of solventless, free radical initiated enamels for this application. Thin film dosimetry is used to determine the irradiation uniformity and spectral quality of geometries suitable for single pass curing using one-sided or unilateral illumination of wire. Recent developments in the electron curing of laminating adhesives for the production of various paper, film and foil constructions are reviewed. The solvent free nature of these electron curable coatings and adhesives, coupled with the very low energy investment required for their cure (
机译:在搪瓷线制造中,在热干燥塔中使用的高溶剂含量涂层的固化构成了具有高特定能耗和大气污染的过程。提出了实验结果,证明使用低能量电子(150keV)从帘式电子源以均匀固化溶性固化,自由基引发的搪瓷用于本申请。薄膜剂量测定法用于确定适合使用线路的单侧或单侧照明的单一通道固化的几何形状的照射均匀性和光谱质量。综述了层压粘合剂用于生产各种纸,薄膜和箔结构的电子固化的最新进展。这些电子固化涂料和粘合剂的溶剂无性,加上其固化所需的低能量投资(

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