High bandwidth low latency chip to chip interconnects using highperformance MLC glass ceramic POWER4R MCM

摘要

This paper describes a high performance multi-layer ceramic (MLC)four chip glass-ceramic multi-chip module (MCM) that achieves very highbandwidth and low latency performance by incorporating unique designapproaches and features. These include leveraging an I/O ring patternarrangement using the fine line capability of IBM's High PerformanceGlass Ceramic (HPGC) and the capability to use 30+ wiring layers withisolating reference planes. The attendant signal integrity is assured byproviding a tailored reference structure to control impedance andcross-talk coupling while maintaining the chip C4 I/O area densitywithout requiring thin-films or degrading the power integrity