IEEE 10th Topical Meeting on Electrical Performance of ElectronicPackaging (Cat. No. 01TH8565)

摘要

The 10th Topical Meeting on Electrical Performance of ElectronicPackaging provides a forum for the presentation and discussion of thelatest advances in electrical design, analysis and characterization ofon-chip and package interconnections and structures for digital, mixedsignal, RF, microwave and mm-wave applications. The following topics aredealt with: server systems; RF/microwave; transmission line modeling;power distribution; EM modeling; model order reduction; powerdecoupling; system design, measurement and modeling; low power issues