首页> 外文会议>Electrical Performance of Electronic Packaging, 2001 >Generalized PEEC models for three-dimensional interconnectstructures and integrated passives of arbitrary shapes
【24h】

Generalized PEEC models for three-dimensional interconnectstructures and integrated passives of arbitrary shapes

机译:三维互连的通用PEEC模型任意形状的结构和集成无源元件

获取原文

摘要

This paper presents the generalization of the Partial ElementEquivalent Circuit method that facilitates its application to themodeling of structures of arbitrary shapes. This is achieved through thedevelopment of partial element equivalent circuit models usingtriangular cells and prisms as the fundamental building blocks formodeling conductor surfaces and conductor/dielectric volumes. The newPartial Element Equivalent Circuit models are demonstrated through theirapplication to the quantification of electromagnetic coupling incrossing wires
机译:本文介绍了部分元素的一般化 等效电路方法,有助于将其应用于 任意形状的结构建模。这是通过 使用以下方法开发部分元件等效电路模型 三角形像元和棱柱作为基本的构建基块 模拟导体表面和导体/电介质体积。新的 通过其部分元素等效电路模型进行了演示 在电磁耦合定量分析中的应用 交叉线

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号