A Fast Method for Detecting and Locating BGA Based on Twice Grading and Linking Technique

摘要

BGA (Ball Grid Array) component with multi-pins and fine-pitch is difficult to detect and locate in electronic manufacturing process. The capability of detecting and locating algorithm designed for BGA directly affects the speed and accuracy of assembling BGA type PCB (Printed Circuit Board). This paper analyzes the difficulties of recognizing and locating BGA firstly. Then, based on BGA''s symmetry and its ball grids'' distributing characteristics, a new fast detecting and locating method for BGA is proposed, in which a twice grading and linking technique is used to sort BGA''s solder balls in the stored array accurately in order to locate BGA on PCB more precisely. The result demonstrates that the algorithm''s performance is better than Point-Pattern Matching algorithm''s and can meet the practical demand of mounting BGA components.