首页> 外文会议>International Mechanical Engineering Congress and Exposition 2007 >MCAD - ECAD INTEGRATION: OVERVIEW AND FUTURE RESEARCH PERSPECTIVES
【24h】

MCAD - ECAD INTEGRATION: OVERVIEW AND FUTURE RESEARCH PERSPECTIVES

机译:MCAD-ECAD集成:概述和未来研究前景

获取原文

摘要

The domain of Electrical Computer-Aided Design and Engineering (ECAD/ECAE) has been subject to major and rapid change over the past couple of years. Electrical Engineering Computer-Aided Design (CAD) tools developed in the early to mid-1990s no longer meet future requirements. Consequently, a new generation of Electrical Engineering CAD systems has been under development for about a decade now. An overview of advances in this field is presented in the introductory part of this paper. This overview also sets the context and provides background information for the main topic, MCAD-ECAD-integration, to be addressed in the remainder of this paper. Many complex engineered systems encompass mechanical as well as electrical engineering components. Unfortunately, contemporary CAE environments do not provide a sufficient degree of integration in order to allow for multi-disciplinary product modeling and bi-directional information flow (i.e. automated design modifications on either side) between mechanical and electrical CAD domains. Overcoming this barrier of systems integration would release a tremendous efficiency potential with regard to the efficient development of multidisciplinary product platforms and configurations. An overview of the state-of-the-art in MCAD-ECAD integration is presented. In addition, associated research questions are postulated and potential future research perspectives discussed.
机译:在过去的几年中,电气计算机辅助设计和工程(ECAD / ECAE)领域经历了重大而快速的变化。在1990年代初至中期开发的电气工程计算机辅助设计(CAD)工具不再满足未来的需求。因此,新一代的电气工程CAD系统已经开发了大约十年。本文的简介部分概述了该领域的进展。本概述还为主要主题MCAD-ECAD-integration设置了上下文并提供了背景信息,将在本文的其余部分中进行介绍。许多复杂的工程系统都包含机械和电气工程组件。不幸的是,当代的CAE环境没有提供足够的集成度,以允许在机械和电气CAD域之间进行多学科的产品建模和双向信息流(即,在任一侧进行自动设计修改)。克服系统集成的障碍,将为多学科产品平台和配置的有效开发释放巨大的效率潜力。概述了MCAD-ECAD集成的最新技术。此外,还提出了相关的研究问题,并讨论了潜在的未来研究前景。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号