MECHANICAL AND THERMAL PROPERTIES OF RHEOCAST TELECOM COMPONENT USING LOW SILICON ALUMINIUM ALLOY IN AS-CAST AND HEAT-TREATED CONDITIONS

摘要

The growing demand for increasingly more cost and energyeffective electronics components is a challenge for themanufacturing industry. To achieve higher thermal conductivity intelecom components, an aluminum alloy with a composition ofAl-2Si-0.8Cu-0.8Fe-0.3Mn was created for rheocasting. Yieldstrength and thermal conductivity of the material wereinvestigated in the as cast, T5 and T6 heat-treated conditions. Theresults showed that in the as-cast condition thermal conductivityof 168 W/mK and yield strength of 67 MPa was achieved at roomtemperature. A T5 treatment at 200°C and 250°C increasedthermal conductivity to 174 W/mK and 182 W/mK, respectively,while only a slight increase in yield strength was observed.Moreover, a T6 treatment resulted in similar thermal conductivityas the T5 treatment at 250°C with no significant improvement inyield strength. Therefore, the T5 treatment at 250°C wassuggested as an optimum condition for the current alloycomposition.