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A Sub-mW All-Passive RF Front End with Implicit Capacitive Stacking Achieving 13 dB Gain, 5 dB NF and +25 dBm OOB-IIP3

机译:具有隐式电容堆叠的SubmW全无源RF前端,可实现13 dB增益,5 dB NF和+25 dBm OOB-IIP3

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This paper presents a sub-mW mixer-first RF front-end that exploits a novel capacitive stacking technique in an altered bottom-plate N-path filter/mixer to achieve passive voltage gain and high-linearity at low noise figure. Capacitive stacking is realized implicitly by reading out the voltage from the bottom-plate of N-path capacitors instead of their top-plate, which provides a 2x gain at the read-out capacitors. Additional passive voltage gain is achieved using impedance upconversion while improving the out-of-band linearity performance of small switches. With no other active circuitry, only clock generation circuits determine the total power consumption of this RF front-end. A prototype is fabricated in GF22 nm FDSOI technology. Operating at fLO= 1 GHz, the prototype achieves a voltage gain of 13 dB, 5 dB Noise Figure and +25/+66 dBm Out-of-band IIP3/IIP2 at 160 MHz offset while consuming only 600 μW of power from a 0.8 V supply.
机译:本文介绍了一种低于mW的混频器优先的RF前端,该前端在改变的底板N路径滤波器/混频器中采用了新颖的电容性堆叠技术,从而在低噪声系数下实现了无源电压增益和高线性度。通过从N路径电容器的底板而不是顶板读出电压,隐式实现了电容堆叠,这在读出电容器处提供了2倍的增益。使用阻抗上变频可实现额外的无源电压增益,同时改善小型开关的带外线性度性能。在没有其他有源电路的情况下,只有时钟生成电路才能确定此RF前端的总功耗。原型是使用GF22 nm FDSOI技术制造的。在f运行 LO 在1 GHz的频率下,该原型实现了13 dB的电压增益,5 dB的噪声系数和160 MHz偏移时的+ 25 / + 66 dBm带外IIP3 / IIP2,而从0.8 V电源仅消耗了600μW的功率。

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