Anomaly detection of solder joint on print circuit board by using Adversarial Autoencoder

摘要

We propose a defect detection method of solders on a printed circuit board using X-ray CT inspection system andAdversarial Autoencoder (AAE). We obtain sliced images of the solder using X-ray CT and extract their features thatfollow the standard normal distribution by using AAE. Then, the solder defects are detected by Hotelling's T square. Asa result of experiments, we show that we can classify normal and anomalous data samples completely on the condition oftraining with large normal samples and small anomalous samples.