首页> 外文会议>Multiple-Valued Logic, 2000. (ISMVL 2000) Proceedings. 30th IEEE International Symposium on >Standard CMOS implementation of a multiple-valued logicsigned-digit adder based on negative differential-resistancedevices
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Standard CMOS implementation of a multiple-valued logicsigned-digit adder based on negative differential-resistancedevices

机译:多值逻辑的标准CMOS实现基于负微分电阻的有符号数字加法器设备

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This paper presents MOS-NDR, a new prototyping technique formultiple-valued logic circuits combining MOS transistors and multipeaknegative differential-resistance (NDR) devices such asresonant-tunneling diodes (RTDs). MOS-NDR emulates the foldedcurrent-voltage characteristics of NDR devices such as RTDs using onlyNMOS transistors, MOS-NDR has enabled the development of a fullyintegrated multivalued signed-digit full adder (SDFA) circuit by meansof a standard 0.6-micron CMOS process technology. The prototype has beenfabricated and correct operation has been verified. The circuitdimensions are 123.75 by 38.7 microns, which is more than 15 timessmaller than the area required by the equivalent hybrid RTD-CMOSprototype. The propagation delay of the hybrid RTD-CMOS design isestimated to be close to six times higher than that of the MOS-NDRimplementation
机译:本文介绍了MOS-NDR,一种新的原型技术 结合MOS晶体管和多峰的多值逻辑电路 负差分电阻(NDR)器件,例如 谐振隧道二极管(RTD)。 MOS-NDR模拟折叠 仅使用RTD等NDR设备的电流-电压特性 NMOS晶体管,使MOS-NDR得以全面发展 集成多值有符号数字加法器(SDFA)电路 标准的0.6微米CMOS工艺技术。原型已经 虚假的和正确的操作已经过验证。电路 尺寸为123.75 x 38.7微米,是15倍以上 小于等效混合RTD-CMOS所需的面积 原型。混合RTD-CMOS设计的传播延迟为 估计比MOS-NDR高近六倍 执行

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