Electronics packaging-a graduate course for Rutgers UniversitySchool of Electrical and Computer Engineering

摘要

In this talk I will profile a course in electronic packaging thatI am introducing for the spring semester 2001 at Rutgers UniversityGraduate School of Electrical and Computer Engineering. Packaging andits effects on the electrical signal integrity of electronic devices arenot addressed in any of the existing courses at Rutgers. Electronicnoise and signal distortion are introduced in Transistor Circuit Designand Integrated Transistor Circuit Design. However, the proposed courseElectronics Packaging will deal with the electrical characterization andmodeling of the parasitic of integrated circuit packaging. The coursewill be targeted to the general graduate population of Master's studentsand industry part time graduate students that have a background incircuit analysis. Ph.D. students in Solid State and VLSI design willalso find the course useful due to the modeling content