Design and thermo-mechanical analysis of a Dimple-ArrayInterconnect technique for power semiconductor devices

摘要

A simple wireless-bond interconnect technique, termed Dimple-ArrayInterconnect (DAI) technique for packaging power devices and modules ispresented in this paper. Electrical connections onto the devices areestablished by soldering arrays of dimples pre-formed on a metal sheet.Preliminary electrical and thermomechanical modeling results on aprototype DAI power module demonstrated potential advantages of thistechnique to include reduced parasitic noises, improvedthermo-mechanical reliability, as well as lowered processing complexity