During the later 1990's, Tessera introduced a semiconductorpackaging technology called WAVE (Wide Area Vertical Expansion) packageto address the growing need for high pin count, high speed, high thermaldissipation, and high environmental reliability in advanced electronicpackaging. The WAVE technology is an extension of Tessera's compliantpackaging technologies that places a low modulus encapsulant between thesilicon die and the package substrate to solve their CTE mismatchproblem. The WAVE technology allows for compliant verticalinterconnection links to be formed between the ICs and the substrate,with no need for a bond window. These interconnections are madesimultaneously, in contrast to single point wire or lead bonding. Thecompliant interconnections and low modulus encapsulant enable the stresson BGA solder balls to be minimized. The WAVE package utilizes advancedmaterials and design to provide a unique combination of high electricaland thermal performance, high environmental reliability, and costeffective IC interconnection methodology. This paper presents one of thelatest WAVE technology developments at Tessera
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