首页> 外文会议>Electronic Components and Technology Conference, 1993. Proceedings., 43rd >Current carrying capacity of copper conductors in printed wiringboards
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Current carrying capacity of copper conductors in printed wiringboards

机译:印刷线路中铜导体的载流量木板

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The effect of thermal management of the copper conductors on PWBs(printed wiring boards) having different dimensions and arrangements isdiscussed. Design charts have been generated to include the parametersof conductor thickness from 1 to 3 oz, width from 5 to 20 mils, spacingat 8 mils, board thickness from 31 to 62 mils, input current, andtemperature rise up to 50° C. The analysis is based on finite elementmodeling with a heat transfer film coefficient obtained from infraredthermal imaging analysis of a test board. Of all the geometricparameters considered, conductor width and spacing are the primaryparameters influencing thermal resistance. Conductor thickness is next,and board thickness proves to be the least sensitive parameter
机译:铜导体的热管理对PWB的影响 (印刷线路板)具有不同的尺寸和布置 讨论过。已生成设计图以包括参数 导体厚度从1到3盎司,宽度从5到20密耳,间距 在8密耳,板厚从31到62密耳,输入电流和 温度上升到50°C。分析基于有限元 利用从红外获得的传热膜系数进行建模 测试板的热成像分析。在所有几何中 考虑的参数,导体的宽度和间距是主要的 影响热阻的参数。接下来是导体厚度, 并且板厚度被证明是最不敏感的参数

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