The design of high density interconnects (HDI) PCBs is animportant step in design and development of present day electronicproducts. This design is becoming a complex task with the availabilityof a large number of process technologies. Each technology offers itsown cost (yield)/volume/performance optimisation. The designer should beable to do the package design in the context of a selected manufacturingtechnology, and communicate effectively with the fabricator. Thisprocess may be termed as “design for manufacturability”(DFM). While DFM issues are not new to an electronic/PCB designer, theseacquire new importance in the context of proliferation of manufacturingprocesses and increasing performance requirements. In addition, theseissues are in a constant state of flux, as process changes and newprocesses are being introduced on a continuing basis. Consequently,there is a need for the designer to continuously keep track of processimprovements, and take advantage of them to make his product morecompetitive. This paper presents the structure of a course on“design of HDI PCBs for manufacturability”. While it isdesigned as a second level course on electronic packaging, that can beoffered at graduate level. As a larger number of practising engineersare likely to be interested in such a course, it is proposed to make itweb based
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