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Experimental and numerical reliability investigations of FCOBassemblies with process-induced defects

机译:FCOB的实验和数值可靠性研究具有过程引起的缺陷的组件

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To develop comprehensive design guidelines, models and experimentscannot overlook process-induced imperfections in the flip chip on board(FCOB) assemblies. The following items were noted as being significantfactors which were used for modeling and by thermal cycling tests: (a)varying standoff-heights and alternative bump sizes, (b)underfill-particle settling, (c) underfill-void effects, (d)underfill-to-bump coverage, (e) asymmetrical fillets vs. symmetricalfillets. A detailed numerical and experimental reliability study ofperfect and imperfect flip chip assemblies has been completed.Experimental studies of the failure modes and of the mean cycles tofailure are in good agreement with the failure modes and life time, aspredicted by FEM for the different technological variants. A hierarchyof influences was worked out in three levels (important, medium,negligible). Most important imperfections resulting in a strongreliability decrease are particle settling, asymmetrical fillets andsmall and big voids
机译:制定全面的设计指南,模型和实验 不能忽略板上倒装芯片中工艺引起的缺陷 (FCOB)程序集。下列项目被认为是重要的 用于建模和热循环测试的因素:(a) 不同的对峙高度和替代的凸块尺寸,(b) 底部填充颗粒沉降,(c)底部填充无效效应,(d) 底部填充到凸点的覆盖范围,(e)不对称圆角与对称 鱼片。详细的数值和实验可靠性研究 完美且不完美的倒装芯片组装已经完成。 失效模式和平均周期的实验研究 故障与故障模式和寿命非常吻合,因为 由FEM预测的不同技术变体。层次结构 影响的程度分为三个层次(重要,中等, 微不足道)。最重要的缺陷导致强烈的缺陷 可靠性下降的原因是颗粒沉降,不对称圆角和 大大小小的空隙

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