首页> 外文会议>Electrical Contacts, 2000. Proceedings of the Forty-Sixth IEEE Holm Conference on >Contact stress relaxation and resistance change relationships inaccelerated heat age testing
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Contact stress relaxation and resistance change relationships inaccelerated heat age testing

机译:接触应力松弛与电阻变化关系加速热老化测试

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This paper reviews the development of the present practice of heatage reliability testing, (temperature life testing), and formallyidentifies and addresses the inherent concerns of this procedure. A 302day heat age test has been completed to evaluate the resistance behaviorof two D-subminiature contacts at three different elevated temperatures.The results indicate that in heat age conditioning, resistance isaffected by mechanisms other than normal force degradation. Furthermore,the effect reduction in normal force has on a contact may not be evidentunless the contact is disturbed. Therefore, changes in resistance as aresult of heat aging are not necessarily indicative of changes that mayoccur due to loss of normal force in actual use. This investigationsuggests that accelerated heat age testing should be primarily used as apreconditioning test prior to exposing contacts to other environmentswhere reduced normal force may make contacts more susceptible to otherfailure mechanisms
机译:本文回顾了目前热学实践的发展 年龄可靠性测试(温度寿命测试),并正式 确定并解决此过程的内在问题。 302 日热老化测试已经完成,以评估电阻行为 在三个不同的升高温度下两个D超微型触点的数量。 结果表明,在热老化条件下,电阻为 受法向力退化以外的机制的影响。此外, 法向力减小对接触的影响可能不明显 除非接触受到干扰。因此,电阻变化为 热老化的结果不一定表示可能发生的变化 由于在实际使用中失去法向力而发生。这次调查 建议加速热老化测试应主要用作 在将触点暴露于其他环境之前进行预处理测试 减小的法向力可能会使接触点更容易受到其他接触的影响 失败机制

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