首页> 外文会议>Electrical Contacts, 2000. Proceedings of the Forty-Sixth IEEE Holm Conference on >Contact stress relaxation and resistance change relationships in accelerated heat age testing
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Contact stress relaxation and resistance change relationships in accelerated heat age testing

机译:加速热老化测试中的接触应力松弛和电阻变化关系

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This paper reviews the development of the present practice of heat age reliability testing, (temperature life testing), and formally identifies and addresses the inherent concerns of this procedure. A 302 day heat age test has been completed to evaluate the resistance behavior of two D-subminiature contacts at three different elevated temperatures. The results indicate that in heat age conditioning, resistance is affected by mechanisms other than normal force degradation. Furthermore, the effect reduction in normal force has on a contact may not be evident unless the contact is disturbed. Therefore, changes in resistance as a result of heat aging are not necessarily indicative of changes that may occur due to loss of normal force in actual use. This investigation suggests that accelerated heat age testing should be primarily used as a preconditioning test prior to exposing contacts to other environments where reduced normal force may make contacts more susceptible to other failure mechanisms.
机译:本文回顾了热老化可靠性测试(温度寿命测试)当前实践的发展,并正式确定并解决了此过程的内在问题。已经完成302天的热老化测试,以评估两个D超微型触点在三种不同的高温下的电阻行为。结果表明,在热老化条件下,阻力受法向力退化以外的机制的影响。此外,除非触头受到干扰,否则不会明显减小法向力对触头的影响。因此,由于热老化而引起的电阻变化不一定表示实际使用中由于法向力的损失而可能发生的变化。这项研究表明,在将触头暴露于其他环境中之前,加速热老化测试应首先用作预处理测试,在其他环境中,法向力减小可能会使触头更容易受到其他故障机制的影响。

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