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Effect of Hydrogen Addition on the Diffusion Bonding Behavior of Titanium Alloys

机译:加氢对钛合金扩散键行为的影响

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Hydrogen as a temporary alloying element can be used as a powerful tool in optimizing microstructure and mechanical properties of titanium alloys. In this study, the effects of hydrogen addition on the diffusion bonding behaviors of Ti-55 titanium alloy and Ti_2AlNb/TC4 titanium alloys were studied. The DSC/DTA results show hydrogen can escape from titanium alloys under the conditions of high temperature and vacuum. The diffusion bonding ratios and joint strength of Ti-55 titanium alloy are remarkably improved by hydrogenation at relatively low bonded temperature (700 °C). In addition, hydrogen addition can prominently increase the bonding interface strengths of Ti_2AlNb/TC4 titanium alloys through rapid heating. The residual hydrogen content is a key factor for improving the diffusion bonding properties by hydrogenation. Both low-temperature bonding and rapid heating aim to hinder the hydrogen desorption during the diffusion bonding process.
机译:氢作为一种临时合金元素,可以用作优化钛合金微观结构和力学性能的有力工具。本研究研究了添加氢对Ti-55钛合金和Ti_2AlNb / TC4钛合金扩散键行为的影响。 DSC / DTA结果表明,在高温和真空条件下,氢可以从钛合金中逸出。 Ti-55钛合金的扩散结合率和接头强度通过在相对较低的结合温度(700°C)下氢化而显着提高。此外,通过快速加热,添加氢可以显着提高Ti_2AlNb / TC4钛合金的结合界面强度。残留的氢含量是通过氢化改善扩散键合性能的关键因素。低温键合和快速加热均旨在阻碍扩散键合过程中的氢解吸。

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