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From device modeling to characterization: a complete end to end design flow for SiC devices half bridge design

机译:从器件建模到表征:SiC器件的完整端到端设计流程半桥设计

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By using I-V curve tracer and double pulse test results on a SIC device a modified Angelov model was generated, which was used to simulate the overshoot and ringing in the time domain of a half bridge test board. The layout parasitic effects of the printed circuit boards have been taken into consideration by an EM extracted model (S-parameters) used in co-simulation within the transient simulation, including an adoption of the models for passive elements and active devices. The modeling approach was proven as well as the accuracy of the whole design flow to predict the device behavior on any application board by simulation before building a prototype.
机译:通过在SIC器件上使用I-V曲线示踪剂和双脉冲测试结果,生成了改进的Angelov模型,该模型用于在半桥测试板的时域中模拟过冲和振铃。瞬态仿真中用于协同仿真的EM提取模型(S参数)已考虑到印刷电路板的布局寄生效应,包括采用无源元件和有源器件的模型。建模方法以及整个设计流程的准确性得到了证明,可以在构建原型之前通过仿真在任何应用板上预测设备行为。

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