Implementing a 32 x 32 2D Capacitive Micromachined Ultrasonic Transducer (CMUT) Array Incorporating Silicon-Through-Glass-Via (Si-TGV) Interconnects

摘要

A 2D transducer array is an essential component of an ultrasound system with 3D beamforming capability. CMUT technology has enabled the possibility of developing complex transducer geometries for different applications. In this work, we demonstrate the fabrication of a 32x32-element 2D CMUT array on a glass substrate using silicon through-glass-via interconnects. Introducing silicon vias in glass substrate enables improvement in fabrication yield. Preliminary results show the successful demonstration of the proposed fabrication process. The fabricated vacuum-sealed devices show a resonant frequency of 4.7 MHz in air.