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Linking Chip, Board, and System Test via Standards

机译:通过标准链接芯片,电路板和系统测试

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This paper introduces a standards-based framework which enables two types of test re-use: direct re-use of test patterns written for low-level components of a system, and access by high-level tests of test features embedded within the low-level components. The underlying mechanism for both is the encapsulation, retargeting, and transformation of test procedures through successive layers of hardware interfaces, as codified in two standards being developed by IEEE Working Groups (P1687.1 and P2654). Examples demonstrate the steps in the process and illustrate both the challenges and opportunities of this approach.
机译:本文介绍了一种基于标准的框架,该框架支持两种类型的测试重用:直接重用为系统的低级组件编写的测试模式,以及通过对低级组件中嵌入的测试功能进行高级测试来访问级组件。两者的基本机制是通过连续的硬件接口层对测试过程进行封装,重新定位和转换,这是IEEE工作组正在制定的两个标准(P1687.1和P2654)中所规定的。实例演示了该过程中的步骤,并说明了此方法的挑战和机遇。

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