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Qualification of NIR, UV and Laser Irradiation as Alternative Photonic Sintering Methods for Printed Electronics

机译:NIR,UV和激光辐射作为印刷电子的替代性光子烧结方法的资格

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Printed Electronics creates new areas of applications with a new manner of manufacturing electronics. Due to its technical and 3D design freedom, new markets and innovative products arise that were initially unthinkable. However, the focus of research is currently on mastering and improving the printing process. The subsequent process step of drying and densifying the printed structures to achieve high conductivities in the shortest possible time is up to now hardly considered. This paper treats the inquiry of fitted and optimized parameters of alternative promising photonic sintering methods for printed electronics compared to the much more time-intensive state of the art sintering process in a furnace. These photonic sintering methods comprise the near infrared, ultraviolet light as well as laser irradiation of the printed structures. Photonic sintering promises faster and more efficient curing and sintering due to the direct and selective application of energy to the printing structures without damaging the temperature-sensitive substrates. As substrate materials ABS and PC-ABS, as well as a glass material were used. Both polymer materials are standard and technical thermoplastics which are available at the market in huge quantities at low price. For the manufacture of printed circuits, a dispense printer was used, in order to process a low-cost silver-based micro particle paste. The evaluation of the sintering result was carried out based on the electrical conductivity of the printed conductor path and the adhesion strength on the substrate. In addition, the sintering time required for the curing of the structures as well as impacts on the substrate or the printed tracks due to photonic treatment were taken into account. To perform the experiments, two different print layouts were set up in order to be able to assess the electrical properties on the first layout and the adhesion on the second layout. To obtain a detailed statement on the exploration on the photonic sintering methods, a fully factorial design plan was conducted. For the near-infrared irradiation, the important parameters were the irradiation duration and the irradiation power. While sintered by ultraviolet light, the parameters were irradiation time, as well as the distance between the sample surface and the UV emitter. In the treatment by means of laser radiation, laser power and the motion speed were identified as the relevant parameters. In order to be able to draw a comparison to the mainly used sintering method, samples were also sintered in a furnace. The results show a significant reduction of the sintering time to a few seconds with comparable and even significantly better electrical and mechanical properties.
机译:印刷电子以制造电子的新方式开创了新的应用领域。由于其技术和3D设计的自由度,出现了最初无法想象的新市场和创新产品。但是,目前的研究重点是掌握和改进打印过程。迄今为止,几乎没有考虑到随后的干燥和致密化印刷结构以在尽可能短的时间内实现高电导率的工艺步骤。与炉子中最耗时的现有烧结工艺相比,本文探讨了印刷电子设备的其他有希望的光子烧结方法的拟合参数和优化参数的询问。这些光子烧结方法包括近红外,紫外光以及印刷结构的激光辐照。由于直接和选择性地将能量施加到印刷结构而不会损坏对温度敏感的基材,因此光子烧结有望实现更快,更有效的固化和烧结。作为基板材料,使用ABS和PC-ABS以及玻璃材料。两种聚合物材料都是标准热塑性塑料和工业热塑性塑料,可在市场上以低价大量购买。为了制造印刷电路,使用了分配打印机,以便处理低成本的银基微粒糊剂。烧结结果的评估是根据印刷导体路径的电导率和在基板上的粘合强度进行的。此外,还考虑了结构固化所需的烧结时间以及由于光子处理而对基板或印刷线路造成的影响。为了进行实验,设置了两个不同的印刷版图,以便能够评估第一个版图上的电性能和第二个版图上的附着力。为了获得有关光子烧结方法探索的详细说明,我们进行了充分析因的设计计划。对于近红外照射,重要的参数是照射持续时间和照射功率。在用紫外线烧结时,参数是辐照时间,以及样品表面与紫外线发射器之间的距离。在通过激光辐射进行的治疗中,激光功率和运动速度被确定为相关参数。为了能够与主要使用的烧结方法进行比较,还在炉子中烧结了样品。结果表明,烧结时间显着减少到几秒钟,同时具有相当甚至更好的电气和机械性能。

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