Low Temperature Solder (LTS) -Evolving Performance, Growing Opportunities

摘要

1. Share industry learnings on Sn-Bi based Low Temp Solder alloy adoption 2. Understand industry concerns on Sn-Bi based Low Temp solder alloys 3. Encourage industry to increase adoption of Sn-Bi based Low Temp solder alloy 1. What is Low Temperature Solder 2. Why is it being considered 3. Opportunities & Challenges 1. Low Temp is any solder, to be used in Printed Circuit Assembly, that would be processed below the old SnPb baseline a. Melting Point/Liquidous Temps are generally in the 130-160°C range b. Peak solder joint temperatures are generally in the 170-200°C range c. Typically contain Bismuth (Bi) 2. A commercially available example is 50Bi48Sn+2% micro additions.