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High Frequency Inductors for GaN Applications: Construction Analysis and Efficiency Comparison

机译:GaN应用的高频电感器:结构分析和效率比较

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With the increasing usage of high-frequency silicon power stages and the near-term, widespread adoption, of GaN/SiC it is necessary to take a detailed look at the existing power inductor technology to determine their compatibility with these new application conditions. At present there are multiple inductor technologies advertised as high-frequency solutions including various molded powder, composite core, magnetic resin and ferrite core solutions. This paper will review the construction of these various solutions, detail issues with calculating losses and present data and analysis of actual inductor loss measurements. In addition, inductor metrics are identified and used to compare inductor performance by way of component level testing and actual in-circuit power loss measurements. By comparing the resultant data, the most suitable solution for high-frequency applications is realized.
机译:随着高频硅功率级使用的增加以及GaN / SiC在近期的广泛应用,有必要详细研究现有的功率电感器技术,以确定它们与这些新应用条件的兼容性。目前,有多种电感器技术被宣传为高频解决方案,包括各种模压粉末,复合磁芯,磁性树脂和铁氧体磁芯解决方案。本文将回顾这些解决方案的构造,详细介绍计算损耗以及当前数据和实际电感器损耗测量结果的分析问题。此外,还可以识别电感器指标,并通过组件级测试和实际的在线功率损耗测量来比较电感器性能。通过比较结果数据,可以实现最适合高频应用的解决方案。

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