Thermal Chips Layout Method in MCM Based on an Improved Particle Swarm Algorithm

摘要

The emergence of Multichip Module(MCM) means that the development of component technology is greatly improved in number, speed and performance. Research on thermal layout optimization methods for MCM can promote its reliability, this paper established a numerical relationship model between junction temperature and coordinates of each chip. and uses ANSYS to simulate and analyze the temperature profile of the optimization results. This paper compares several typical optimization schemes based on w , and presents the improved particle swarm algorithm . Experimental results show that improved particle swarm algorithm can improve inertia weight and maximum speed effectively, and also can achieve lower chip junction temperature in chip layout.