首页> 外文会议>SPIE Photonics Europe Conference >Through-focus Scanning Optical Microscopy Applications
【24h】

Through-focus Scanning Optical Microscopy Applications

机译:透焦扫描光学显微镜应用

获取原文
获取外文期刊封面目录资料

摘要

We present a partial application space of the metrology method referred to as through-focus scanning optical microscopy (TSOM), with most number of favorable attributes as a metrology and process control tool. TSOM is a NIST-developed, high-throughput and low-cost optical metrology tool for dimensional characterization with sub-nanometer measurement resolution of nano-scale to microscale targets using conventional optical microscopes, with many unique benefits and advantages. In TSOM the complete set of out-of-focus images are acquired using a conventional optical microscope and used for dimensional analysis. One of the unique characteristics of the TSOM method is its ability to reduce or eliminate optical cross correlations, often challenging for optical based metrology tools. TSOM usually has the ability to separate different dimensional differences (i.e., the ability to distinguish, for example, linewidth difference from line height difference) and hence it is expected to reduce measurement uncertainty. TSOM is applicable to a wide variety of target materials ranging from transparent to opaque, and shapes ranging from simple nanoparticles to complex semiconductor memory structures, including buried structures under transparent films. TSOM has been successfully applied to targets ranging from one nm to over 100 μn (over five orders or magnitude size range). Demonstrated applications of TSOM include critical dimension (linewidth). overlay, patterned defect detection and analysis, FinFETs, nanoparticles, photo-mask linewidth, thin-film (less than 0.5 nm to 10 nm) thickness, through-silicon vias (TSVs), high-aspect-ratio (HAR) targets and others with several potential three-dimensional shape process monitoring applications such as MEMS/NEMS devices, microanofluidic channels, flexible electronics, self-assembled nanostructures, and waveguides. Numerous industries could benefit from the TSOM method -such as the semiconductor industry, MEMS. NEMS, biotechnology, nanomanufacturing. nanometrology, data storage, and photonics. TSOM, through focus, optical microscope, nanometrology, process control, nanomanufacturing, nanoparticles,
机译:我们介绍了一种称为透焦扫描光学显微镜(TSOM)的计量方法的部分应用空间,其中大部分优点是计量和过程控制工具。 TSOM是NIST开发的一种高通量,低成本的光学计量工具,用于尺寸表征,使用常规光学显微镜可实现从纳米级到微米级目标的亚纳米级测量分辨率。在TSOM中,使用常规光学显微镜可获取完整的散焦图像集,并将其用于尺寸分析。 TSOM方法的独特特征之一是它具有减少或消除光学互相关的能力,这对于基于光学的计量工具而言通常具有挑战性。 TSOM通常具有分离不同尺寸差异的能力(即,区分线宽差异和线高差异的能力),因此有望减少测量的不确定性。 TSOM适用于从透明到不透明的各种目标材料,形状从简单的纳米粒子到复杂的半导体存储结构,包括透明膜下的掩埋结构,都可以使用。 TSOM已成功应用于从1 nm到超过100μn(超过5个数量级或大小范围)的目标。 TSOM的演示应用包括关键尺寸(线宽)。覆盖,图案化缺陷检测和分析,FinFET,纳米颗粒,光掩模线宽,薄膜(小于0.5 nm至10 nm)厚度,硅通孔(TSV),高纵横比(HAR)靶材和其他具有多种潜在的三维形状过程监控应用,例如MEMS / NEMS器件,微/纳流体通道,柔性电子器件,自组装纳米结构和波导。 TSOM方法可以使许多行业受益,例如半导体行业,MEMS。 NEMS,生物技术,纳米制造。纳米计量学,数据存储和光子学。 TSOM,通过聚焦,光学显微镜,纳米计量学,过程控制,纳米制造,纳米颗粒,

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号