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Electric Field Assisted Placement of Carbon Nanotubes Using Sacrificial Graphene Electrodes

机译:电场辅助放置碳纳米管的牺牲石墨烯电极。

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Here we detail a complete process flow to overcome the challenge of placement of carbon nanotubes on solid surfaces, limiting "bottom-up", large-scale integration in semiconductor process technology. To date most bottom up placement strategies are based on surface functionalization having the drawback that chemical modifications can deteriorate the deposited carbon nanotubes. The application of dielectrophoretic techniques eliminates the chemical treatment, however, it necessitates the usage of conductive electrodes typically made out of metal. These metallic electrodes limit performance, scaling, and density of integrated electronic devices. Here, we report a method for electric-field assisted placement of purely semiconducting carbon nanotubes from solution at predefined locations by means of large-scale graphene layers having patterned nanoscale deposition sites. The patterned graphene layers can be removed residue-free after carbon nanotube deposition. In order to demonstrate the application potential, we have assembled at predefined substrate locations carbon nanotubes of varying density and integrated them into field-effect transistor. The graphene-based placement process, implemented with nanoscale resolution at wafer scale, could enable mass manufacturing of application-specific electronics based on carbon nanotubes.
机译:在这里,我们详细介绍了完整的工艺流程,以克服将碳纳米管放置在固体表面上的挑战,从而限制了半导体工艺技术中“自下而上”的大规模集成。迄今为止,大多数自下而上的放置策略都基于表面官能化,其缺点是化学修饰会破坏沉积的碳纳米管。介电泳技术的应用消除了化学处理,但是,它必须使用通常由金属制成的导电电极。这些金属电极限制了集成电子设备的性能,规模和密度。在这里,我们报告了一种方法,该方法通过具有图形化纳米级沉积位点的大规模石墨烯层,在预定位置进行溶液中的纯半导体碳纳米管的电场辅助放置。碳纳米管沉积后,可以无残留地去除图案化的石墨烯层。为了展示其应用潜力,我们在预定的基板位置组装了密度可变的碳纳米管,并将其集成到场效应晶体管中。在晶圆级以纳米级分辨率实施的基于石墨烯的放置工艺可以实现基于碳纳米管的专用电子产品的批量生产。

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