Skin Effect Suppressed NiFe/Cu Electroplated Multilayer Wiring for High Data-Rate and Low Delay-Time I/O Interface Board.

摘要

This paper proposes a new application of skin effect suppression technology [1]-[4] for long wiring on high-speed & low-delay I/O board (typical wiring length; 200 to 1000 mm). This proposal will overcome the difficulty to further reduce the transmission losses on the I/O board with >50 Gbps data rate, which is currently performed by lowering dielectric substrate losses and surface smoothing of Cu conductor. A major challenge in this paper is to demonstrate the skin effect suppression by electroplated magnetic/conductor multilayer, instead of sputter-deposited thin film in literature [2]-[4], in order to meet coming cost-effective, thick (>5 μm), large area, and high throughput mass productivity requirements. High frequency (>10 GHz) estimation of complex permeability and measurements of low resistance devices are also investigated.