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22-nm FD-SOI Embedded MRAM Technology for Low-Power Automotive-Grade-l MCU Applications

机译:适用于低功耗汽车级MCU的22nm FD-SOI嵌入式MRAM技术

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We demonstrate 22-nm FD-SOI 40Mb embedded MRAM (eMRAM) macros for automotive-grade-l (Auto-G1) MCU applications, highlighting sub-ppm to bit error rate and zero failure after 1M endurance cycles across Auto-G1 operating temperature range (-40~150 °C). Read disturbance characterization with external field also reveals that 40Mb eMRAM macro is capable of active-mode magnetic immunity > 500 Oe at 150 °C. In addition, based on 22-nm eMRAM macro data, we review the effects of magnetic tunnel junction (MTJ) size on reliability and examine scalability of eMRAM technology beyond 22 nm.
机译:我们演示了针对汽车级I(Auto-G1)MCU应用的22nm FD-SOI 40Mb嵌入式MRAM(eMRAM)宏,重点介绍了在Auto-G1工作温度下经过1M续航周期后,误码率达到亚ppm且零故障。范围(-40〜150°C)。具有外部场的读取干扰特征还表明,在150°C时40Mb eMRAM宏能够具有大于500 Oe的有源模式磁抗扰度。此外,基于22纳米eMRAM宏数据,我们回顾了磁隧道结(MTJ)尺寸对可靠性的影响,并考察了22纳米以上eMRAM技术的可扩展性。

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