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Trap-Aware Compact Modeling and Power-Performance Assessment of III-V Tunnel FET

机译:III-V隧道FET的陷阱感知紧凑模型和功率性能评估

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We report, for the first time, on a SPICE simulation study of the circuit-level power-performance impact of device traps in a state-of-the-art III-V heterojunction tunnel FET (TFET). First, the individual parasitic effects of junction bulk traps and oxide interface traps are incorporated in a compact model and validated against measurement-calibrated TCAD data, where we propose an analytical formulation for trap-assisted tunneling at the heterojunction and account for the oxide interface charge with a look-up table. Then, the model is used in SPICE simulations on a ring oscillator test bench to predict the impact of traps on logic circuits. It is found that bulk and oxide traps in TFET together cause up to ~5× iso-frequency energy penalty in the desired low-supply-voltage domain (≤ 0.50 V), of which oxide traps dominate at high switching activity while bulk and oxide traps contribute comparably when switching is less active. This study quantitatively suggests that trap reduction is the key to the enablement of the full benefit of TFET.
机译:我们首次报告了有关最新技术的III-V异质结隧道FET(TFET)中器件陷阱的电路级功率性能影响的SPICE仿真研究。首先,将结体陷阱和氧化物界面陷阱的个体寄生效应合并到一个紧凑模型中,并针对测量校准的TCAD数据进行了验证,在此我们为异质结处的陷阱辅助隧穿提出了解析公式,并考虑了氧化物界面电荷与查询表。然后,将该模型用于环形振荡器测试台上的SPICE仿真中,以预测陷阱对逻辑电路的影响。已发现,在所需的低电源电压域(≤0.50 V)中,TFET中的体陷阱和氧化物陷阱共同导致高达〜5倍的等频能量损失,其中氧化物陷阱在高开关活动中起主导作用,而体氧化物和氧化物陷阱在高开关活动中起主导作用当切换不太活跃时,陷阱的贡献相当。这项研究定量地表明,减少陷阱是实现TFET的全部优势的关键。

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