Enhancement in Electrical Properties of UV-cured Resin by Establishing H-bonding Between Al2O3 Nanoparticles and Acrylate Molecular Chain

摘要

Surface functionalization of Al2O3nanoparticles by H2O2and 1H, 1H, 2H, 2H-perfluorooctyltriethoxysilane was developed to improve the dielectric properties of UV-cured resin matrix (UV). Herein, interfacial hydrogen bonds were established between Al2O3nanofillers and acrylate molecular chain by using surface hydroxylated Al2O3 (h-Al2O3) and fluorine modified Al2O3 (f-Al2O3) nanoparticles. And then, the UV based composites filled with c-Al2O3, h-Al2O3and f-Al2O3particles were fabricated. The electrical properties of composites and the effect of interfacial strength on electrical properties were systematically investigated. It is found that the electrical properties are closely related to interfacial bonding strength and trap levels. The greater interfacial strength leads to larger the volume of the interaction zone, and larger electrostatic potential leads to deeper trap levels with enhanced trapping effect, thereby restraining the carriers injection and migration. As a result, UV/h-Al2O3and UV/f-Al2O3composites exhibit better space charge suppression characteristics, larger volume resistivity, and higher breakdown strength than that of UV/c-Al2O3composites. The research results are conducive to promoting SLA 3D printing in application of electrical and electronic field.