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Stress State in Cr Coatings During Deposition and Post-Deposition Ageing and Annealing

机译:沉积,沉积后时效和退火过程中铬涂层的应力状态

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1. Same conditions leading to Cr(OH)_3 incorporation are responsible for H_2 evolution and incorporation. These are low values of current efficiency leading to a high interfacial pH values and very negative rest potential of electrode surface during Cr(lll) electroreduction leading to a water reduction and generation of large quantities of H_2/ H~* at the interface.
机译:1.导致Cr(OH)_3掺入的相同条件是H_2析出和掺入的原因。这些是电流效率的低值,导致高的界面pH值,并且在Cr(III)电解还原过程中电极表面的负电势非常负,从而导致水的还原和在界面处生成大量的H_2 / H〜*。

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