首页> 外文会议>Conference on metrology, inspection, and process control for microlithography XXXI >Computational overlay metrology with adaptive data analytics
【24h】

Computational overlay metrology with adaptive data analytics

机译:具有自适应数据分析功能的计算叠加计量

获取原文

摘要

With photolithography as the fundamental patterning step in the modern nanofabrication process, every wafer within a semiconductor fab will pass through a lithographic apparatus multiple times. With more than 20,000 sensors producing more than 700GB of data per day across multiple subsystems, the combination of a light source and lithographic apparatus provide a massive amount of information for data analytics. This paper outlines how data analysis tools and techniques that extend insight into data that traditionally had been considered unmanageably large, known as adaptive analytics, can be used to show how data collected before the wafer is exposed can be used to detect small process dependent wafer-to-wafer changes in overlay.
机译:在现代纳米制造工艺中,将光刻作为基本的构图步骤,半导体晶圆厂中的每个晶圆都会多次通过光刻设备。超过20,000个传感器每天在多个子系统之间产生700GB以上的数据,光源和光刻设备的结合为数据分析提供了大量信息。本文概述了如何使用数据分析工具和技术将洞察力扩展到传统上被认为难以管理的数据(称为自适应分析),以显示晶圆曝光之前收集的数据如何用于检测与小工艺有关的晶圆,晶圆叠层中的变化。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号