A dual-band wireless power transfer and backscatter communication approach for implantable neuroprosthetic devices

摘要

We present a dual-band HF and UHF fully-integrated implantable neuroprosthetic testbed. This testbed includes a custom implanted device as well as an external system based on a commercially available USRP B210 software defined radio (SDR) platform. The implanted device integrates a BPSK backscatter uplink rate of 5 Mbps, an HF WPT efficiency of 47% with a power consumption of 1.332 milliwatt. The implanted device measures 25 mm diameter and has a total thickness of 2.8 mm including the printed circuit substrate, antenna, all circuitry, and silicone encapsulation. It supports up to 10 neural and 4 electromyogram (EMG) channels with a sampling rate of 26.1 kHz for the neural channels and 1.628 kHz for the EMG channels. The communication link is shown to have 0% packet error rate at an implant depth of up to 2.5 cm.