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Elimination of bus voltage impact on temperature sensitive electrical parameter during turn-on transition for junction temperature estimation of high-power IGBT modules

机译:消除了在大功率IGBT模块的结温估算的导通过渡期间总线电压对温度敏感电参数的影响

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Junction temperature is of great importance to safe operating area of IGBT modules. Various information of the IGBT operating state is reflected on electrical characteristics during turn-on transient. A unified extraction method for internal junction temperature via dynamic thermo-sensitive electrical parameters (DTSEP) during turn-on transient is proposed. Two DTSEP, turn-on delay time (tdon) and the maximum increasing rate of collector current dic/dt(max), are combined to eliminate the bus voltage impact. Using the inherent emitter-auxiliary inductor LeE in high-power modules, the temperature-dependent DTSEPs can be converted into a low-voltage and measurable signal. Finally, experiment results are exhibited to verify the effectiveness of proposed method.
机译:结温对于IGBT模块的安全工作区域至关重要。 IGBT工作状态的各种信息反映在导通瞬态期间的电气特性上。提出了一种在开启瞬态过程中通过动态热敏电参数(DTSEP)统一提取内部结温的方法。结合两个DTSEP,即开启延迟时间(t don )和集电极电流的最大增加率di c / dt(max),以消除总线电压的影响。使用大功率模块中的固有发射器辅助电感器L eE ,可以将依赖于温度的DTSEP转换为低压且可测量的信号。最后,通过实验结果验证了所提方法的有效性。

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