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Characterization thin films TiO_2 obtained in the magnetron sputtering process

机译:磁控溅射过程中表征的TiO_2薄膜

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The aim of the study was to elucidate influence parameters of magnetron sputtering process on growth rate and quality of titanium dioxide thin films. TiO_2 films were produced on two inch silicon wafers by means of magnetron sputtering method. Characterization of samples was performed using ellipsometer and atomic force microscope (AFM). Current-voltage (I-V) and capacitance-voltage (C-V) measurements were also carried out. The results enable to determine impact of pressure, power, gases flow and process duration on the physical parameters obtained layers such as electrical permittivity, flat band voltage and surface topography. Experiments were designed according to orthogonal array Taguchi method. Respective trends impact were plotted.
机译:该研究的目的是阐明磁控溅射工艺对二氧化钛薄膜的生长速率和质量的影响参数。利用磁控溅射法在两英寸的硅片上制备了TiO_2薄膜。使用椭偏仪和原子力显微镜(AFM)对样品进行表征。还进行了电流-电压(I-V)和电容-电压(C-V)测量。结果使得能够确定压力,功率,气体流量和工艺持续时间对所获得的物理参数层的影响,例如电容率,平坦带电压和表面形貌。根据正交阵列田口法设计实验。绘制了各个趋势的影响。

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