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Practical method for modeling conductor roughness using cubic close-packing of equal spheres

机译:使用相等球体的三次密堆积模拟导体粗糙度的实用方法

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In the GB/s regime, accurate modeling of conductor loss is a precursor to successful high-speed serial link design. By using available conductor roughness data published in manufacturers' data sheets, an equivalent multi-sphere model, based on the cubic closed-packing of equal spheres, is presented and applied to the Huray roughness model.
机译:在GB / s体制下,导体损耗的精确建模是成功进行高速串行链路设计的前提。通过使用制造商数据表中发布的可用导体粗糙度数据,提出了一种基于相等球体的立方闭合堆积的等效多球体模型,并将其应用于Huray粗糙度模型。

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