A Study of the Thermal and Parasitic optimization of a large current density highly parallelized three-phase reference Board for Motor Drive

摘要

This paper discusses the challenges and solutions of designing a three phase motor drive board for applications requiring 100 A or higher output current. The approach of using multiple parallel MOSFETs in an ultra-low inductive half bridge package is described. A unique reference design PCB is presented that is constructed to meet both thermal as well as symmetry requirements when it comes to handling the parallelization of multiple MOSFETs. Thermal simulation and electro-thermal measurements are used to verify the designs and to further deepen the know-how on compact high density PCBs.