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A new Ag paste composed of nano- and micro-Ag particles prepared simultaneously and its application as dieattachment materials

机译:同时制备由纳米和微米级Ag颗粒组成的新型Ag糊料及其在芯片附着中的应用

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Although nano-Ag was developed to attach a die to substrates, and high performance in joint strength and electronic conductivity were realized, the complicated synthesis process and low yield of nano-Ag, and high joint pressure and temperature largely limited the application of nano-Ag in the industry. Here, a simple two-step polyol process was used to simultaneously synthesize nano and micro-Ag particles in large-scale and high-yield. The size and size distribution of Ag particles depended on the reaction parameters. These Ag particles were used to make hybrid Ag pastes to joint Cu sheets. Shear strengths over 40 and 52 MPa were achieved by using an Ag paste composed of nano-Ag particles and micro-Ag particles under
机译:尽管开发了纳米银以将管芯附着到基板上,并且实现了在连接强度和电子导电性方面的高性能,但是纳米银的合成工艺复杂,产率低,以及高的联合压力和温度极大地限制了纳米银的应用。银行业。在这里,简单的两步多元醇工艺被用于同时大规模和高产率地合成纳米和微米银颗粒。 Ag颗粒的尺寸和尺寸分布取决于反应参数。这些Ag颗粒用于将杂化的Ag浆料制成接合的Cu片。通过使用由纳米Ag颗粒和微米Ag颗粒组成的Ag糊剂,在40到200 MPa的剪切强度达到了40 MPa和52 MPa。

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