New era in automotive electronics, a co-development by Georgia tech and its automotive partners

摘要

The new trends in automotive electronics such as autonomous driving, in-car infotainment, and all-electric cars, require an entirely different electronic vision and technologies than are pursued today for automotive industry. Georgia Tech proposes system scaling as a new frontier to address the upcoming era of automotive challenges. It also proposes an innovative 3D system package architecture taking into account electrical, mechanical and thermal designs as well as new digital, RF, sensors, radar millimeter-wave and power technologies. It proposes highly innovative large panel-based, ultra-thin glass packaging with many innovations in electrical, thermal, mechanical designs, materials, processes, wiring lithography, fine-pitch and high-throughput assembly and highly-conductive through-Cu vias for signal, power and heat transfer. Such an approach is proposed to lead to highly-functional sub-systems for integration of disparate set of technologies at lowest cost, in smallest ultra-miniaturized size with shortest interconnections with lowest power consumption.